The film is tailored for solid panel and honeycomb sandwich constructions, exhibiting strong bonding capabilities in temperatures ranging from -55°C (67°F) to 121°C (250°F). It offers high fracture toughness, peel strength, and excellent moisture resistance, both pre and post-curing. Moreover, it facilitates a rapid cure at 225°F (90 minutes) and supports low-pressure bonding and vacuum cure processes.

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